Qianli - ToolPlus Hot Bat LP550 iPhone BGA CPU NAND Glue Removal Heating Platform
SKU
Tools-Other-Qli-HotBat
QianLi ToolPlus Hot Bat LP550 iPhone BGA CPU NAND Glue Removal Heating Platform
- QianLi ToolPlus Hot Bat LP550 Heating Platform for removing black glue on iPhone BGA CPU NAND.
- Supports iPhone A8 A9 A10 A11 CPU and all types of iPhone NAND IC's.
- Safest Method to remove black glue.
- Save time on repairs.
$19.26
In stock
Availability : 4 Left
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