Qianli - ToolPlus Hot Bat LP550 iPhone BGA CPU NAND Glue Removal Heating Platform

SKU
Tools-Other-Qli-HotBat

QianLi ToolPlus Hot Bat LP550 iPhone BGA CPU NAND Glue Removal Heating Platform

  • QianLi ToolPlus Hot Bat LP550 Heating Platform for removing black glue on iPhone BGA CPU NAND.
  • Supports iPhone A8 A9 A10 A11 CPU and all types of iPhone NAND IC's.
  • Safest Method to remove black glue.
  • Save time on repairs.
$19.26

In stock

Availability : 4 Left
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