Carbon Black
Thermal Paste
Designed specially to replace the proprietary
black thermal compound
used in many Apple devices
Carbon Black™ is an innovative thermal compound designed to fill large heatsink gaps while outperforming thermal pads.
Not electrically conductive.
Eliminates die and component hotspots.
Provides an exceptional heatsink seal for maximum thermal conductivity.
Will not dry out, crack, or separate.
Effectively fills large heatsink gaps.
Developed and manufactured in the United States.
SEE HOW IT WORKS
@InjuredGadgets
Carbon Black™ was specifically formulated for use on
several Apple devices such as:
This thick, gritty, black thermal paste
is only found on Apple devices, and
no comparable product exits on the
market... until now.